Endoscope image-capturing device and endoscope device

ABSTRACT

An endoscope image-capturing device includes: a first case inside of which is sealed; an image sensor arranged inside the first case; an electro-optic conversion element arranged outside the first case and configured to convert an image signal output from the image sensor into an optical signal; and a sealing member sealing the electro-optic conversion element.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application claims priority to and incorporates by referencethe entire contents of Japanese Patent Application No. 2015-133614 filedin Japan on Jul. 2, 2015.

BACKGROUND

The present disclosure relates to an endoscope image-capturing deviceand an endoscope device.

An endoscope device in the medical field captures an image of the insideof an observation target (living body) such as a human by using an imagesensor so as to observe the inside of this living body (refer toJapanese Patent Application Laid-open No. 2012-245045 and JapanesePatent Application Laid-open No. 2005-66129, for example).

The endoscope device (endoscope system) disclosed in Japanese PatentApplication Laid-open No. 2012-245045 is a head-separated endoscopedevice including an insertion unit (endoscope scope) inserted into theliving body, an endoscope image-capturing device (camera head) includingan image sensor configured to capture an object image condensed by theinsertion unit, a control device (image processor) configured to processan image signal output from the image sensor, and a cable electricallycoupling between the image sensor and the control device.

In order to protect the image sensor of the endoscope image-capturingdevice against a medicinal solution used in sterilization involvingwiping and liquid immersion and high-temperature and high-pressure vaporin autoclave processing (high-temperature and high-pressure vaporsterilization), this image sensor is arranged in a sealed casing theinside of which is sealed (held watertightly and airtightly). In theendoscope image-capturing device, a sealing connector such as awaterproof connector or a hermetic connector is attached to an openingof the sealed casing to transmit the image signal from the image sensorarranged inside the sealed casing to the outside of the sealed casingwhile maintaining the sealability (watertightness and airtightness) ofthe sealed casing. Then, the image signal from the sealing connector istransmitted to a control device such as an image processor through acable (refer to Japanese Patent Application Laid-open No. 2012-245045).

Similarly to the endoscope device disclosed in Japanese PatentApplication Laid-open No. 2012-245045, an endoscope device disclosed inJapanese Patent Application Laid-open No. 2005-66129 is a head-separatedendoscope device.

The endoscope image-capturing device (camera head) disclosed in JapanesePatent Application Laid-open No. 2005-66129 is provided, inside thisendoscope image-capturing device, with an electro-optic conversionelement (E/O converter) configured to convert an image signal (electricsignal) from the image sensor into an optical signal. The endoscopeimage-capturing device is configured to transmit the image signal fromthe image sensor as the optical signal to the control device through thecable. Transmission of the image signal as an optical signal isadvantageous, in particular, for an increase in the data amount of theimage signal for high image quality such as what is called 4K and 8K anda speeding up of signal transmission.

SUMMARY

When the endoscope image-capturing device using the sealed casingdisclosed in Japanese Patent Application Laid-open No. 2012-245045employs the optical transmission as disclosed in Japanese PatentApplication Laid-open No. 2005-66129, the following problem occurs.

The sealing connector disclosed in Japanese Patent Application Laid-openNo. 2012-245045 includes a plurality of conductive pins penetratingbetween the inside and outside of the sealed casing. These conductivepins electrically couple the image sensor and the cable (controldevice). In other words, a typical sealing connector transmits anelectric signal.

An additional configuration that enables transmission of an opticalsignal complicates the configuration of the disclosed sealing connector,resulting in an increase in the cost and size of the sealing connector.

The electro-optic conversion element includes a light source configuredto emit light such as laser light. This light source is repeatedlyturned on and off in optical communication, and thus typically has alifetime shorter than that of the image sensor. When the image sensorand the electro-optic conversion element are provided in the same sealedcasing, a sealed structure (sealed casing) necessary for the imagesensor needs to be temporarily unlocked to replace the electro-opticconversion element due to its failure and lifetime, and after thereplacement, the sealability needs to be achieved again, which isreflected on the cost of the replacement.

For this reason, the following configuration is preferred to achieve theoptical transmission as disclosed in Japanese Patent ApplicationLaid-open No. 2005-66129 with the endoscope image-capturing devicedisclosed in Japanese Patent Application Laid-open No. 2012-245045.

Specifically, the electro-optic conversion element is provided outsidethe sealed casing. An image signal from the image sensor is transmittedas an electric signal to the outside of the sealed casing through thesealing connector. Then, this image signal (electric signal) isconverted into an optical signal by the electro-optic conversion elementarranged outside the sealed casing. Then, this optical signal istransmitted to the control device through the cable.

However, with this configuration as described above, the electro-opticconversion element is provided outside the sealed casing, making itdifficult to protect the electro-optic conversion element against amedicinal solution used in sterilization involving wiping and liquidimmersion and high-temperature and high-pressure vapor in autoclaveprocessing.

There is a need for an endoscope image-capturing device and an endoscopedevice that each achieve a small configuration that optically transmitsan image signal at low cost, and protect the electro-optic conversionelement against a medicinal solution used in sterilization involvingwiping and liquid immersion and high-temperature and high-pressure vaporin autoclave processing.

An endoscope image-capturing device according to one aspect of thepresent disclosure includes: a first case inside of which is sealed; animage sensor arranged inside the first case; an electro-optic conversionelement arranged outside the first case and configured to convert animage signal output from the image sensor into an optical signal; and asealing member sealing the electro-optic conversion element.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic configuration of an endoscope deviceaccording to an embodiment of the present disclosure;

FIG. 2 is a perspective diagram of a camera head illustrated in FIG. 1when viewed from a base end side (side with which a composite cable iscoupled);

FIG. 3 is a perspective diagram of a sealed unit illustrated in FIG. 2when viewed from a base end side (side with which an electro-opticcombined module is coupled);

FIG. 4 is a perspective diagram of a sealing connector illustrated inFIG. 3 when viewed from the inside of the sealed unit;

FIG. 5 is a perspective diagram of the electro-optic combined moduleaccording to the embodiment of the present disclosure when viewed from ahead side (side with which the sealed unit coupled);

FIG. 6 is a perspective diagram of the internal structure of theelectro-optic combined module illustrated in FIG. 5 when viewed from abase end side (side with which the composite cable coupled);

FIG. 7 illustrates the internal structure of the electro-optic combinedmodule illustrated in FIG. 5 when viewed from a side;

FIG. 8 is a perspective diagram of a receptacle illustrated in FIGS. 5to 7 when viewed from a base end side (side with which first and secondprinted-circuit boards are coupled);

FIG. 9 illustrates an array of a plurality of contacts illustrated inFIG. 8;

FIG. 10 is a sectional view schematically illustrating an electro-opticconversion element mounted on a first printed-circuit board illustratedin FIGS. 6 and 7;

FIG. 11A is a perspective diagram illustrating that the firstprinted-circuit board is attached to the receptacle illustrated in FIGS.6 and 7 when viewed from a base end side of the receptacle;

FIG. 11B is an exploded perspective view illustrating that the firstprinted-circuit board is removed from the receptacle illustrated inFIGS. 6 and 7 when viewed from the base end side of the receptacle;

FIG. 12 illustrates a method of filling inside a second case illustratedin FIGS. 5 and 7 with a filling member;

FIG. 13 illustrates modification 1 of the embodiment of the presentdisclosure;

FIG. 14 illustrates the shapes of first conductive pins illustrated inFIG. 13; and

FIG. 15 illustrates modification 2 of the embodiment of the presentdisclosure.

DETAILED DESCRIPTION

Modes (hereinafter referred to as embodiments) for carrying out thepresent disclosure will be described below with reference to theaccompanying drawings. The embodiments described below do not limit thepresent disclosure. Any identical parts in the drawings are denoted byidentical reference numerals.

Schematic Configuration of Endoscope Device

FIG. 1 illustrates a schematic configuration of an endoscope device 1according to an embodiment of the present disclosure.

The endoscope device 1 is used in the medical field to observe theinside of an observation target (living body) such as a human.

As illustrated in FIG. 1, the endoscope device 1 includes an insertionunit 2, a light source device 3, a light guide 4, a camera head 5, acomposite cable 6, a display device 7, and a control device 8.

The insertion unit 2 is hard and elongated, and inserted into the livingbody. An optical system for condensing an object image is provided inthe insertion unit 2.

The light source device 3 is coupled with one end of the light guide 4to supply, through this one end of the light guide 4, light forilluminating inside the living body.

The light guide 4 has one end detachably coupled with the light sourcedevice 3, and the other end detachably coupled with the insertion unit2. The light guide 4 transfers the light supplied from the light sourcedevice 3 from the one end to the other end so as to supply the light tothe insertion unit 2. The light supplied to the insertion unit 2 isemitted through a head of this insertion unit 2 to irradiate inside theliving body. Then, the light (object image) emitted to the inside of theliving body is condensed through the optical system in the insertionunit 2.

The camera head 5 has the functionality of an endoscope image-capturingdevice according to the present disclosure. The camera head 5 isdetachably coupled with a base end of the insertion unit 2. Undercontrol of the control device 8, the camera head 5 captures the objectimage condensed through the insertion unit 2 and performs anelectro-optic conversion on an image signal (electric signal) throughthis image capturing to obtain and output an optical signal.

The configuration of the camera head 5 is described later in detail.

The composite cable 6 includes a plurality of optical fibers 61 (referto FIG. 6) and a plurality of electric signal cables 62 (refer to FIG.6) under an outer cover 60 (refer to FIG. 6) as an outermost layer. Thecomposite cable 6 has one end detachably coupled with the control device8 and the other end coupled with the camera head 5.

The optical fibers 61 are arranged at a central position when viewed ina cross-section of the composite cable 6, and communicate an opticalsignal between the camera head 5 and the control device 8.

The electric signal cables 62 are arranged at a peripheral part of theoptical fibers 61 when viewed in the cross-section of the compositecable 6, and communicate an electric signal between the camera head 5and the control device 8.

The display device 7 displays an image under control of the controldevice 8. In the present embodiment, the display device 7 has a monitorsize of 55 inches or larger, but the present disclosure is not limitedthereto. The display device 7 may have other monitor sizes.

The control device 8 acquires the optical signal (image signal) outputfrom the camera head 5 through each optical fiber 61, and performs anelectro-optic conversion on this optical signal into an electric signal.Then, the control device 8 performs predetermined processing on theelectric signal provided with the electro-optic conversion and displaysthe image captured by the camera head 5 on the display device 7. Thecontrol device 8 also outputs a control signal or other signals(electric signals) to the camera head 5 through the electric signalcables 62.

Configuration of Camera Head

FIG. 2 is a perspective diagram of the camera head 5 when viewed from abase end side (side with which the composite cable 6 is coupled).

As illustrated in FIG. 2, the camera head 5 includes a coupler 51, asealed unit 52, and an electro-optic combined module 9 (refer to FIG.6).

In FIG. 2, a tubular cover 53 covering a base end side of the sealedunit 52 and the electro-optic combined module 9 is attached, and thusthe electro-optic combined module 9 is not illustrated.

The coupler 51 is used to detachably couple the camera head 5 with thebase end of the insertion unit 2, and is provided to the head of thecamera head 5.

FIG. 3 is a perspective diagram of the sealed unit 52 when viewed from abase end side (side with which the electro-optic combined module 9 iscoupled).

As illustrated in FIG. 2 or 3, the sealed unit 52 includes a sealed-unitside case 521, a sealing connector 522 (FIG. 3), and an image sensor 523(refer to FIG. 4).

The sealed-unit side case 521 has the functionality of a first caseaccording to the present disclosure. The sealed-unit side case 521 ismade of, for example, titanium, titanium alloy, or stainless steelalloy. As illustrated in FIG. 3, the sealed-unit side case 521 is arectangular housing having openings 5211 (FIG. 3 illustrates the opening5211 on a base end side only) on its head side (side with which the baseend of the insertion unit 2 is coupled) and its base end side (side withwhich the electro-optic combined module 9 is coupled).

The opening (not illustrated) on the head side is sealed with atranslucent member (not illustrated) such as glass that transmits theobject image condensed through the insertion unit 2. As illustrated inFIG. 3, the opening 5211 on the base end side is engaged and sealed withthe sealing connector 522. Accordingly, the inside of the sealed-unitside case 521 is sealed with the translucent member and the sealingconnector 522 described above.

The sealed-unit side case 521 houses a lens unit (not illustrated), adriving motor (not illustrated), and the image sensor 523.

The lens unit images the object image condensed through the insertionunit 2 on an imaging plane of the image sensor 523. The lens unit ismovable in the direction of an optical axis.

In response to a press on each of switches 5212 to 5215 (FIG. 2, FIG. 3)exposed on the outer surface of the sealed-unit side case 521, thedriving motor moves the lens unit in the optical axis to performadjustment of the focal length and focus of the lens unit.

The image sensor 523 includes a charge coupled device (CCD) or acomplementary metal oxide semiconductor (CMOS) that receives lightcondensed through the lens unit and converts the light into an electricsignal.

In the present embodiment, only one image sensor 523 is provided, butthe present disclosure is not limited thereto, and a plurality of imagesensors 523 may be provided. In the present embodiment, the total numberof effective pixels as the sum of the numbers of effective pixels of oneor a plurality of image sensors 523 is eight megapixels (for example,what is called 4K resolution of 3840×2160 pixels) or larger, but thepresent disclosure is not limited thereto, and the total numbers ofeffective pixels may be other numbers.

The sealed structure of the sealed unit 52 including the sealed-unitside case 521 and the sealing connector 522 may be a watertightstructure, but includes the image sensor 523, which is expensive andprovided with fine adjustment of the optical axis for image capturingwith an external and/or internal optical system. In order to reduce anyfailure due to intrusion of a medicinal solution and vapor into theinside as much as possible, the sealed unit 52 preferably has anairtight structure having a sealing level higher than that of thewatertight structure. In this case, the sealing connector 522 ispreferably a hermetic connector.

FIG. 4 is a perspective diagram of the sealing connector 522 when viewedfrom the inside of the sealed unit 52.

The sealing connector 522 has the functionality of a blocking partaccording to the present disclosure, and as illustrated in FIG. 3, isfixed to the opening 5211 of the sealed-unit side case 521 by welding,for example.

The sealing connector 522 is a circular connector and includes a firstouter frame 5221, a plate 5222, and a plurality of conductive pins 5223as illustrated in FIG. 3 or 4.

The first outer frame 5221 is made of a metal material and has acylinder shape.

The plate 5222 is made of a metal material and is a circular plate. Theplate 5222 blocks the first outer frame 5221.

The conductive pins 5223 each have the functionality of a terminalaccording to the present disclosure and have a cylindrical shape. Theconductive pins 5223 are inserted into a plurality of openings (notillustrated) penetrating between the front and back surfaces of theplate 5222, respectively. These openings, in which the conductive pins5223 are inserted, are sealed by a plurality of insulating members madeof an insulating material such as glass. In other words, the conductivepins 5223 are attached to the plate 5222 while being insulated from eachother without conducting with the plate 5222 by the insulating membersdescribed above.

In the following, first conductive pins 5224 refer to the conductivepins 5223 provided in a first region Ar1 illustrated by the dashed andsingle-dotted line in FIG. 4 among the conductive pins 5223. Secondconductive pins 5225 refer to the conductive pins 5223 provided in twosecond regions Art illustrated with the dashed and double-dotted line inFIG. 4 among the conductive pins 5223.

The first region Ar1 includes a central axis Ax in the first outer frame5221 when viewed in the direction of the central axis Ax (FIG. 4) of thefirst outer frame 5221, and is a strip-shaped region extending in thehorizontal direction in FIG. 4. The two second regions Ar2 are regionsother than the first region Ar1 in the first outer frame 5221, and arestrip-shaped regions parallel to the first region Ar1 and extending inthe horizontal direction in FIG. 4.

The first conductive pins 5224 are arranged side by side in two linesextending in the vertical direction of FIG. 4 in the first region Ar1.

Similarly to the first conductive pins 5224, the second conductive pins5225 are arranged side by side in two lines extending in the verticaldirection of FIG. 4 in each second region Ar2.

As illustrated in FIG. 4, a sealed-unit side printed-circuit board 524that relays (electrically couples) the conductive pins 5223 and theimage sensor 523 is attached to the sealing connector 522 toward theinside of the sealed unit 52.

The sealed-unit side printed-circuit board 524 relays an image signal(electric signal) output from the image sensor 523 to the firstconductive pins 5224. The sealed-unit side printed-circuit board 524also relays, to the image sensor 523, a control signal or other signals(electric signals) output from the control device 8 through thecomposite cable 6, the electro-optic combined module 9, and the secondconductive pins 5225.

Configuration of Electro-Optic Combined Module

FIG. 5 is a perspective diagram of the electro-optic combined module 9when viewed from a head side (side with which the sealed unit 52 iscoupled). FIG. 6 is a perspective diagram of the internal structure ofthe electro-optic combined module 9 when viewed from a base end side(side with which the composite cable 6 is coupled). FIG. 7 illustratesthe internal structure of the electro-optic combined module 9 whenviewed from a side.

The electro-optic combined module 9 is mechanically and electricallycoupled with the sealing connector 522. The electro-optic combinedmodule 9 converts an image signal (electric signal) output from theimage sensor 523 into an optical signal and outputs the optical signalthrough the composite cable 6 (the optical fibers 61). The electro-opticcombined module 9 relays a control signal or other signals (electricsignals) output from the control device 8 through the electric signalcables 62, to the sealing connector 522 (the image sensor 523).

As illustrated in FIGS. 5 and 7, the electro-optic combined module 9includes a receptacle 91, a first printed-circuit board 92 (FIGS. 6 and7), two second printed-circuit boards 93 (FIGS. 6 and 7), a module-sidecase 94 (FIGS. 5 and 7), and a filling member 95 (FIG. 7).

For the purpose of illustration, FIG. 6 does not illustrate themodule-side case 94, the filling member 95, and a protection member 611(refer to FIG. 10) to be described later.

Configuration of Receptacle

FIG. 8 is a perspective diagram of the receptacle 91 when viewed from abase end side (side opposite to a side with which the sealing connector522 coupled (side with which the first and the second printed-circuitboards 92 and 93 are coupled)).

The receptacle 91 includes a circular connector mechanically andelectrically coupled with the sealing connector 522, and is provided tothe head of the electro-optic combined module 9.

As illustrated in FIG. 8, the receptacle 91 includes a second outerframe 911, an insulator 912, and a plurality of contacts 913.

The second outer frame 911 is made of a metal material and has acylindrical shape.

The insulator 912 is made of an insulating material and blocks thesecond outer frame 911. The insulating material of the insulator 912 ispreferably a material that is advantageous in terms of resistanceagainst high temperature, vapor, and sterilization. Examples of such amaterial include resin such as polypropylene (PP), polyvinylidenechloride (PVDC), polyether ether ketone (PEEK), polyaceta (POM),polyamide (PA) such as nylon, polycarbonate (PC),polytetrafluoroethylene (PTFE), polyimide (PI), polyamide-imide (PAI),polybutylene terephthalate (PBT), and engineering plastic known asPEKEKK (polyether ketone ether ketone ketone), as well as glass andceramics.

As illustrated in FIG. 5 or 8, the insulator 912 has insertion holes9121 into which the conductive pins 5223 of the sealing connector 522may be inserted when the sealing connector 522 and the receptacle 91 arecoupled.

The insertion holes 9121 are each formed in such a staged shape that itspart on a head side (side with which the sealing connector 522 iscoupled) of the receptacle 91 has a circular shape along the shape(cylindrical shape) of the conductive pins 5223 and its part on the baseend side of the receptacle 91 has a rectangle shape surrounding thishead side in a sectional view when viewed in the direction of a centralaxis Ax′ (FIG. 8) of the second outer frame 911.

As illustrated in FIG. 8, the contacts 913 are provided on a base endside in the insertion holes 9121. The contacts 913 are electricallycoupled with the conductive pins 5223 when the conductive pins 5223 ofthe sealing connector 522 are inserted into the insertion holes 9121.

FIG. 9 illustrates an array of the contacts 913.

In the following, first contacts 914 refer to the contacts 913 providedin a first region Ar1′ illustrated with the dashed and single-dottedline in FIG. 9 among the contacts 913. Second contacts 915 refer to thecontacts 913 provided in two second regions Ar2′ illustrated with thedashed and double-dotted line in FIG. 9 among the contacts 913.

The first region Ar1′ is opposite to the first region Ar1 illustrated inFIG. 4. The first region Ar1′ is a strip-shaped region including thecentral axis Ax′ in the second outer frame 911 when viewed in thedirection of the central axis Ax′ (FIG. 9) of the second outer frame 911and extending in the horizontal direction in FIG. 9. The two secondregions Ar2′ are opposite to the respective two second regions Ar2illustrated in FIG. 4. The two second regions Ar2′ are regions otherthan the first region Ar1′ in the second outer frame 911, which areparallel to the first region Ar1′, and are strip-shaped regionsextending in the horizontal direction in FIG. 9.

The first contacts 914 are arrayed in a similar manner to the firstconductive pins 5224. In other words, the first contacts 914 arearranged side by side in two lines extending in the vertical directionof FIG. 9 in the first region Ar1′.

The second contacts 915 are arranged in a similar manner to the secondconductive pins 5225. In other words, the second contacts 915 arearranged side by side in two lines extending in the vertical directionof FIG. 9 in each second regions Ar2′.

The first contacts 914 arrayed as described above have identical shapes.The following describes the shape of one of the first contacts 914.

As illustrated in FIG. 8 or 9, the first contacts 914 each include afirst contact body 9141 and a first pin-shaped part 9142.

The first contact body 9141 is provided in the insertion holes 9121, hasa substantially U shape when viewed in the direction of the central axisAx′, and extends along the central axis Ax′. The first contact body 9141is electrically coupled with the conductive pins 5223 with its U-shapedinner periphery part being in contact with an outer periphery part ofthe conductive pins 5223 when the conductive pins 5223 are inserted intothe insertion holes 9121.

The first pin-shaped part 9142 has a curved surface and protrudes from aU-shaped base end part of the first contact body 9141 toward the baseend side (side on which the first and the second printed-circuit boards92 and 93 are arranged) of the receptacle 91, and is formed as a platespring that may be elasticity deformed.

The first contacts 914 arranged side by side in the first column on anupper side in FIG. 9 in the first region Ar1′ are provided to theinsertion holes 9121 so that the opening part of the U shape of eachfirst contact body 9141 faces upward (the first pin-shaped part 9142 ispositioned on a lower side). The first contacts 914 arranged side byside in the second column on the lower side are provided to theinsertion holes 9121 so that the opening part of the U shape of eachfirst contact body 9141 faces downward (the first pin-shaped part 9142is positioned on the upper side).

The second contacts 915 arrayed as described above have identicalshapes. The following describes the shape of one of the second contacts915.

As illustrated in FIG. 8 or 9, the second contacts 915 each include asecond contact body 9151 and a second pin-shaped part 9152.

The second contact body 9151 has the same shape and function as those ofthe first contact body 9141.

The second pin-shaped part 9152 linearly protrudes along the centralaxis Ax′ from a base end part of the U shape of the second contact body9151 toward the base end side of the receptacle 91.

The second contacts 915 arranged in the second region Ar2′ on the upperside in FIG. 9 are provided to the insertion holes 9121 so that theopening part of the U shape of the second contact body 9151 faces upward(the second pin-shaped part 9152 is positioned on the lower side). Thesecond contacts 915 arranged in the second region Ar2′ on the lower sideare provided to the insertion holes 9121 so that the opening part of theU shape of the second contact body 9151 faces downward (the secondpin-shaped part 9152 is positioned on the upper side).

Configuration of First Printed-Circuit Board

FIG. 10 is a sectional view schematically illustrating an electro-opticconversion element 921 mounted on the first printed-circuit board 92.

The first printed-circuit board 92 has the functionality of aprinted-circuit board according to the present disclosure, and is arigid substrate on which, for example, the electro-optic conversionelement 921 (FIG. 10) that converts an electric signal into an opticalsignal is mounted. The first printed-circuit board 92 is electricallycoupled with the first contacts 914 of the receptacle 91, and relays, tothe electro-optic conversion element 921, an image signal (electricsignal) output from the image sensor 523 through the sealed-unit sideprinted-circuit board 524, the first conductive pins 5224, and the firstcontacts 914.

As illustrated in FIG. 10, the electro-optic conversion element 921 iscoupled with the optical fibers (only one of the optical fibers 61 isillustrated in FIG. 10) each coated by the protection member 611 madeof, for example, silicone resin. In other words, the electro-opticconversion element 921 converts an image signal (electric signal) intoan optical signal and outputs the optical signal to the optical fibers61.

In the present embodiment, only one electro-optic conversion element 921is provided, but the present disclosure is not limited thereto, and aplurality of electro-optic conversion elements 921 may be provided. Inthe present embodiment, a plurality of optical fibers 61 are provided,but the present disclosure is not limited thereto, and a necessarynumber of optical fiber 61, for example, one optical fiber 61 may beprovided.

As illustrated in FIG. 10, a shield case 922 is attached to a surface ofthe first printed-circuit board 92, on which the electro-opticconversion element 921 is mounted.

The shield case 922 is made of a metal material and has thefunctionality of a shield member that shields electromagnetic noise. Asillustrated in FIG. 10, the shield case 922 has a substantiallyrectangular parallelepiped container shape without one side surface, andis attached to the surface of the first printed-circuit board 92 so thatthe electro-optic conversion element 921 is positioned in its inside(the shield case 922 covers an outer surface of the electro-opticconversion element 921). In other words, the shield case 922 shieldsinfluence of electromagnetic noise on the electro-optic conversionelement 921 from the outside and the second printed-circuit board 93and/or on other components from the electro-optic conversion element921.

As illustrated in FIG. 10, a cut part 9221 into which the optical fibers61 are inserted is formed on the shield case 922. In other words, theoptical fibers 61 are coupled with the electro-optic conversion element921 arranged inside the shield case 922 through the cut part 9221.

Another element (not illustrated) different from the electro-opticconversion element 921 is mounted at a position facing the electro-opticconversion element 921 on the back surface (surface opposite to thesurface on which the electro-optic conversion element 921 is mounted) ofthe first printed-circuit board 92. A shield case 923 (FIGS. 6 and 7)having the same shape and function as those of the shield case 922 isattached to cover the outer surface of this another element.

As illustrated in FIG. 7, the first printed-circuit board 92 describedabove is arranged on the base end side of the receptacle 91 along thecentral axis Ax′.

FIG. 11A is a perspective diagram illustrating that the firstprinted-circuit board 92 is attached to the receptacle 91 when viewedfrom the base end side of the receptacle 91. FIG. 11B is an explodedperspective view illustrating that the first printed-circuit board 92 isremoved from the configuration of FIG. 11A.

Specifically, the first printed-circuit board 92 is attached to thereceptacle 91 as described below.

In other words, the first printed-circuit board 92 is inserted betweenthe first contacts 914 (first pin-shaped parts 9142) in the first columnon an upper side and the first contacts 914 (first pin-shaped parts9142) in the second column on a lower side in FIGS. 11A and 11B. In thisstate, the first pin-shaped parts 9142 in the first and the secondcolumns are pressed against the first printed-circuit board 92 andelastically deformed to hold the first printed-circuit board 92therebetween. The first pin-shaped parts 9142 in the first and thesecond columns are electrically coupled with lands (not illustrated)formed on the front and back surfaces of the first printed-circuit board92. Then, the first printed-circuit board 92 is fixed to the receptacle91 by soldering the first pin-shaped parts 9142 and the lands in theabove-described state.

Configuration of Second Printed-Circuit Boards

The two second printed-circuit boards 93 are each a flexible substrateat least part of which is bendable. The two second printed-circuitboards 93 relay, to the second contacts 915, a control signal or othersignals (electric signals) output from the control device 8 through theelectric signal cables 62. In other words, the control signal or othersignals (electric signals) relayed to the second contacts 915 are outputto the image sensor 523 through the second conductive pins 5225 and thesealed-unit side printed-circuit board 524.

These two second printed-circuit boards 93 have identicalconfigurations. The following describes the configuration of one of thesecond printed-circuit board 93.

As illustrated in FIG. 6 or 7, the second printed-circuit board 93includes a first coupling part 931 (FIG. 6), a second coupling part 932,and a bridge part 933 (FIG. 6) bridged between the first and the secondcoupling parts 931 and 932.

The first coupling part 931 has a shape corresponding to one of thesecond regions Ar2′. The first coupling part 931 has a plurality ofholes 9311 (FIG. 6) corresponding to the respective second contacts 915(second pin-shaped parts 9152) arranged in this second regions Ar2′.

As illustrated in FIG. 6, the first coupling part 931 is placed on anend face of the insulator 912 on a base end side while the secondcontacts 915 are inserted into the respective holes 9311, and fixed tothe receptacle 91 by soldering lands 9312 provided around the holes 9311and the second pin-shaped parts 9152.

As illustrated in FIG. 6 or 7, the second coupling part 932 is arrangedat a position overlapping the first printed-circuit board 92 in FIG. 6or 7 by folding the bridge part 933 for the first coupling part 931fixed to the receptacle 91.

As illustrated in FIG. 6, a plurality of lands 9321 each having asubstantial rectangular shape are formed on a surface of the secondcoupling part 932. The second coupling part 932 is electrically coupledwith the electric signal cables 62 by soldering the electric signalcables 62 with the lands 9321.

Configuration of Module-Side Case

As illustrated in FIG. 7, the module-side case 94 has a tubular shape,and has an opening part (opening part on the left side in FIG. 7) on oneend engaged with the base end side of the receptacle 91 (side oppositeto the side with which the sealing connector 522 are coupled). Themodule-side case 94 covers the first and the second printed-circuitboards 92 and 93, and a part of the composite cable 6 (parts of theoptical fibers 61 and the electric signal cables 62).

The module-side case 94 has a plurality of fill holes 941 formed on theother end (on the right side in FIG. 7). The fill holes 941 communicatebetween the inside and outside of the module-side case 94 as illustratedin FIG. 7. The filling member 95 is inserted into the fill holes 941.

Configuration of Filling Member

As illustrated in FIG. 7, the filling member 95 is filled inside themodule-side case 94. In the present embodiment, the filling member 95 isa thermal curing resin such as epoxy resin and fluorine resin eachhaving a low moisture permeability and a high barrier against gas.

The material of the filling member 95 is not limited to epoxy resin orfluorine resin, but is, for example, silicone resin.

FIG. 12 illustrates a method of filling inside the module-side case 94with the filling member 95. Specifically, FIG. 12 corresponds to FIG. 7.

A worker inserts the composite cable 6 into the module-side case 94, andattaches the first and the second printed-circuit boards 92 and 93,which are attached to the composite cable 6, to the receptacle 91 bysoldering as described above. Then, the worker engages the base end sideof the receptacle 91 with an opening part of the module-side case 94 onone end (opening part on a lower side in FIG. 12).

Next, as illustrated in FIG. 12, the worker places the receptacle 91 ona desk or the like in such a manner that the receptacle 91 is on a lowerside of the module-side case 94. Then, the worker inserts the needle ofan injector SY (FIG. 12) filled with uncured thermal curing resin (thefilling member 95) in advance into one of the fill holes 941 of themodule-side case 94, and fills inside the module-side case 94 with thisthermal curing resin. When filled at an angle illustrated in FIG. 12,the uncured thermal curing resin (filling member 95) is graduallyaccumulated from one end side of the module-side case 94 (lower side inFIG. 12), and fills up to the other end of the module-side case 94 (FIG.7).

Next after the filling with the uncured thermal curing resin (fillingmember 95), the worker cures this thermal curing resin by heating.

Filling inside the module-side case 94 in this manner, the fillingmember 95 seals the electro-optic conversion element 921 while coveringthe outer surface of the shield case 922 on the first printed-circuitboard 92 (FIG. 7). In other words, the module-side case 94, the shieldcase 922, the first printed-circuit board 92, and the filling member 95form a sealed space (the inside of the shield case 922) so that theelectro-optic conversion element 921 is arranged (sealed) in this space,and thus have the functionality of a sealing member according to thepresent disclosure. The module-side case 94 and/or the shield case 922have the functionality of a second case according to the presentdisclosure.

The above-described space (inside of the shield case 922) is heldwatertightly by the filling member 95.

The filling member 95 entirely fills inside the module-side case 94, butthe present disclosure is not limited thereto. The filling member 95 mayfill at least the openings of the module-side case 94 and the shieldcase 922.

The above-described space (inside of the shield case 922) is heldwatertightly by the filling member 95, but a space in which theelectro-optic conversion element 921 is provided may be held airtightlyby configuring, for example, the module-side case 94 to be airtight. Inthis case, the inside of the module-side case 94 does not need to befilled with the filling member 95.

In the camera head 5 according to the present embodiment describedabove, the image sensor 523 is arranged inside the sealed-unit side case521 which is sealed by the sealing connector 522. The electro-opticconversion element 921 (the first printed-circuit board 92) is arrangedoutside the sealed-unit side case 521. In other words, an image signalfrom the image sensor 523 is transmitted, as an electric signal, to theoutside of the sealed-unit side case 521 through the conductive pins5223 (first conductive pins 5224) of the sealing connector 522, andconverted into an optical signal at the electro-optic conversion element921. The electro-optic conversion element 921 is arranged in the space(inside of the shield case 922) sealed by the module-side case 94, theshield case 922, the first printed-circuit board 92, and the fillingmember 95. In other words, the electro-optic conversion element 921 issealed in such a manner that its outer surface is covered by the fillingmember 95 on the first printed-circuit board 92.

Thus, the camera head 5 according to the present embodiment achieves asmall configuration that optically transmits an image signal at lowcost. In addition, the module-side case 94, the shield case 922, thefirst printed-circuit board 92, and the filling member 95 may protectthe electro-optic conversion element 921 against a medicinal solutionused in sterilization involving wiping and liquid immersion andhigh-temperature and high-pressure vapor in autoclave processing.

In the camera head 5 according to the present embodiment, the fillingmember 95 fills inside the module-side case 94.

Thus, the filling member 95 may protect the entire members (the firstand the second printed-circuit boards 92 and 93, and part of thecomposite cable 6 (part of the optical fibers 61 and the electric signalcables 62)) arranged inside the module-side case 94 againsthigh-temperature and high-pressure vapor in autoclave processing.

In the camera head 5 according to the present embodiment, the shieldcase 922 covering the outer surface of the electro-optic conversionelement 921 is attached to the first printed-circuit board 92. Whilecovering the outer surface of the shield case 922, the filling member 95seals the electro-optic conversion element 921.

Thus, when the inside of the module-side case 94 is filled with theuncured thermal curing resin (filling member 95) and cured, stress dueto cure shrinkage of this thermal curing resin is not directly appliedto the electro-optic conversion element 921. Accordingly, no unwantedstress is applied to coupling parts between the electro-optic conversionelement 921 and the first printed-circuit board 92 and between theelectro-optic conversion element 921 and each optical fiber 61, therebysufficiently maintaining the quality of the camera head 5 afterassembly.

When the coupling parts between the electro-optic conversion element 921and the first printed-circuit board 92 and between the electro-opticconversion element 921 and each optical fiber 61 are reinforced byreinforcing members or the like, and the strength of each coupling partis sufficiently maintained, the filling member 95 may fill inside theshield case 922. Moreover, when the shield case 922 is unnecessarybecause the strength of this coupling part is sufficiently maintained,and influence of electromagnetic noise on the electro-optic conversionelement 921 and/or due to the electro-optic conversion element 921 issufficiently small, the outer surface of the electro-optic conversionelement 921 on the first printed-circuit board 92 coupled with theoptical fibers 61 may be directly covered and sealed by the fillingmember 95.

In the camera head 5 according to the present embodiment, each opticalfiber 61 is coated by the protection member 611 before the uncuredthermal curing resin (filling member 95) fills inside the module-sidecase 94.

Thus, when the inside of the module-side case 94 is filled with theuncured thermal curing resin (filling member 95) and cured, stress dueto cure shrinkage of this thermal curing resin is not directly appliedto the optical fibers 61. Accordingly, no unwanted stress is applied tothe coupling part between each optical fiber 61 and the electro-opticconversion element 921, and no optical fiber 61 is buckled, therebysufficiently maintaining the quality of the camera head 5 afterassembly.

In the camera head 5 according to the present embodiment, the sealingconnector 522 that transmits only an electric signal is adopted as theblocking part according to the present disclosure.

However, a sealing connector with an additional configuration fortransmitting an optical signal would have a complicated configuration,resulting in an increase in the cost and size of the sealing connector.In contrast, using the sealing connector 522 that transmits only anelectric signal may reduce an increase in the cost and size of thesealing connector 522, thereby reducing an increase in the cost and sizeof the camera head 5.

In the camera head 5 according to the present embodiment, the totalnumber of effective pixels of the image sensor 523 is eight megapixelsor larger. When the data amount of image signals from the image sensor523 is large as in this example, optical transmission of the imagesignals is particularly advantageous.

In the endoscope device 1 according to the present embodiment, thedisplay device 7 has a monitor size of 55 inches or larger. When themonitor size is 55 inches or larger as in this example, an operator hasan extremely high sense of immersion into a displayed image, and thusoptical transmission of a large data amount of image signals isparticularly advantageous to display a high-definition image on thedisplay device 7 having such a monitor size.

Other Embodiments

While the present disclosure has been described with reference toexemplary embodiments, it is to be understood that the disclosure is notlimited to the disclosed exemplary embodiment.

FIG. 13 illustrates modification 1 of the embodiment according to thepresent disclosure. Specifically, FIG. 13 is an exploded perspectiveview of a camera head 5A according to the present modification 1 whenviewed from a base end side. FIG. 14 illustrates the shapes of firstconductive pins 5224A illustrated in FIG. 13.

For the purpose of illustration, FIG. 13 does not illustrate themodule-side case 94 and the filling member 95.

In the embodiment described above, the electro-optic combined module 9includes the receptacle 91 and is detachably coupled with the sealedunit 52 (sealing connector 522) through this receptacle 91, but thepresent disclosure is not limited thereto.

For example, as illustrated in FIG. 13, an electro-optic combined module9A that does not include the receptacle 91 included in the electro-opticcombined module 9 described in the above embodiment may be used, and thefirst and the second printed-circuit boards 92 and 93 of thiselectro-optic combined module 9A may be directly attached to a sealingconnector 522A by soldering.

In the sealing connector 522A according to the present modification 1,the first conductive pins 5224 have shapes different from those of thesealing connector 522 described in the above embodiment.

Specifically, similarly to the first pin-shaped part 9142, asillustrated in FIG. 14, the first conductive pins 5224A according to thepresent modification 1 on an external side (side with which theelectro-optic combined module 9A is coupled) of the sealed unit 52 eachhave a curved surface and protrude toward the outside of the sealed unit52, and are each formed as a plate spring that may be elasticallydeformed.

In other words, the first printed-circuit board 92 is inserted betweenthe first conductive pins 5224A in the first column on an upper side inFIG. 14 and the first conductive pins 5224A in the second column on alower side. In this state, the first conductive pins 5224A in the firstand the second columns are pressed against the first printed-circuitboard 92 and elasticity deformed to hold the first printed-circuit board92 therebetween. The first conductive pins 5224A in the first and thesecond columns are electrically coupled with lands (not illustrated)formed on the front and back surfaces of the first printed-circuit board92. Then, the first printed-circuit board 92 is directly fixed to thesealing connector 522A by soldering the first conductive pins 5224A andthe lands in the above-described state.

The two second printed-circuit boards 93 are directly fixed to thesealing connector 522A by soldering the lands 9312 provided around theholes 9311 of the first coupling part 931 and the second conductive pins5225 while the second conductive pins 5225 are inserted into the holes9311 and this first coupling part 931 is placed on an external end faceof the sealed unit 52 of the plate 5222.

Although not specifically illustrated, the module-side case 94, whichcovers the first and the second printed-circuit boards 92 and 93 and thepart of the composite cable 6 (part of the optical fibers 61 and theelectric signal cables 62), has its opening part on one end engaged withthe sealing connector 522A. Similarly to the embodiment described above,the filling member 95 fills a space surrounded by the sealing connector522A and the module-side case 94 (space in which the first and thesecond printed-circuit boards 92 and 93 and part of the composite cable6 are arranged).

FIG. 15 illustrates modification 2 of the embodiment according to thepresent disclosure. Specifically, FIG. 15 schematically illustrates anendoscope device 1B according to the present modification 2.

In the embodiment described above, the present disclosure is applied tothe endoscope device 1 in which the insertion unit 2 and the camera head5 are detachably coupled, but is not limited thereto.

For example, the present disclosure is applicable to the endoscopedevice 1B including an endoscope image-capturing device 5B illustratedin FIG. 15.

Specifically, as illustrated in FIG. 15, the endoscope device 1Bincludes the endoscope image-capturing device 5B in addition to thecomposite cable 6, the display device 7, and the control device 8described in the above embodiment.

As illustrated in FIG. 15, the endoscope image-capturing device 5Bincludes a sealed unit 52B in addition to the electro-optic combinedmodule 9 described in the above embodiment.

As illustrated in FIG. 15, the sealed unit 52B includes a sealed-unitside case 525, an optical system 526, and a printed-circuit board 527 inaddition to the sealing connector 522, the image sensor 523, and thesealed-unit side printed-circuit board 524 described in the aboveembodiment.

The sealed-unit side case 525 has the functionality of the first caseaccording to the present disclosure. The sealed-unit side case 525 ismade of a metal material and has a substantially tubular shape.

The sealed-unit side case 525 has an elongate shape at a part on one end(part on the left side in FIG. 15), and serves as an insertion unit 5251inserted into the inside of the living body. At a part on the other end(part on the right side in FIG. 15), the sealed-unit side case 525 has adiameter larger than that of the insertion unit 5251, and serves as ahold part 5252 held by a doctor, for example.

As illustrated in FIG. 15, the insertion unit 5251 of the sealed-unitside case 525 has an opening 5251B sealed by a translucent member 5253such as glass. The hold part 5252 has an opening 5252B engaged with andsealed by the sealing connector 522. The inside of the sealed-unit sidecase 525 is held airtightly and watertightly by the translucent member5253 and the sealing connector 522.

As illustrated in FIG. 15, the insertion unit 5251 houses the opticalsystem 526 and the image sensor 523.

The optical system 526 is arranged adjacent to the translucent member5253 on a head side of the insertion unit 5251. The optical system 526condenses an object image through the translucent member 5253 to imagethis object image on the imaging plane of the image sensor 523.

The image sensor 523 is the same as the image sensor 523 described inthe above embodiment, and is arranged adjacent to the optical system 526on the head side of the insertion unit 5251.

As illustrated in FIG. 15, the hold part 5252 houses the printed-circuitboard 527 and the sealed-unit side printed-circuit board 524.

The printed-circuit board 527 is electrically coupled with the imagesensor 523 through a signal line SL (FIG. 15) distributed inside thesealed-unit side case 525, and is electrically coupled with thesealed-unit side printed-circuit board 524 attached to the sealingconnector 522. The printed-circuit board 527 provides predeterminedprocessing (A/D conversion, for example) on an image signal output fromthe image sensor 523 and outputs the image signal to the sealed-unitside printed-circuit board 524 (first conductive pins 5224). Theprinted-circuit board 527 drives the image sensor 523 through the signalline SL in response to a control signal output from the control device 8through the composite cable 6, the electro-optic combined module 9, thesecond conductive pins 5225, and the sealed-unit side printed-circuitboard 524.

In the embodiment described above and its modifications 1 and 2, thefilling member 95 substantially thoroughly fills inside the module-sidecase 94, but the present disclosure is not limited thereto. When theelectro-optic conversion element 921 on the first printed-circuit board92 has its outer surface covered and sealed by resin, the electro-opticconversion element 921 may be sealed by potting, for example.

In the embodiment described above and its modifications 1 and 2, thecamera heads 5 and 5A and the endoscope image-capturing device 5Bperform signal communication between the insides (the image sensor 523)of the sealed units 52 and 52B and the electro-optic combined module 9(the first and the second printed-circuit boards 92 and 93) through theconductive pins 5223 of the sealing connectors 522 and 522A and thecontacts 913 of the receptacle 91, but the present disclosure is notlimited thereto. The signal communication may be performed by wirelesssignal communication using, for example, a magnetic field. Thiseliminates the need to provide the conductive pins 5223 and the contacts913 in the sealed units 52 and 52B and the electro-optic combined module9.

The electro-optic conversion element 921 includes, for example, a lightemitting unit such as a laser diode and emits communication light suchas laser light from this light emitting unit. Performance degradation ofoptical transmission of this light emitting unit may be caused by areduction in the amount of emission light due to long-time drive. Thus,the endoscope devices 1 and 1B in the embodiment described above and itsmodifications 1 and 2 may be provided with a replacement notifying unitthat notifies replacement timing of the light emitting unit to anoperator or a serviceperson.

Specifically, the replacement notifying unit includes an energizationtime counting unit that counts an energization time of the lightemitting unit, a non-transitory memory that stores energization timeinformation on the energization time obtained by this energization timecounting unit, a comparing unit that compares an energization time basedon the energization time information stored in this non-transitorymemory to a predetermined replacement time, and a notifying unit thatnotifies, when this comparing unit determines that the energization timeexceeds the predetermined replacement time, the operator or theserviceperson of this determination.

Timing of the notification by the notifying unit may be timing when theenergization time exceeds the predetermined replacement time, timingbefore the energization time exceeds the predetermined replacement time(the energization time is reaching the predetermined replacement time),or both. The predetermined replacement time described above may be setas appropriate for the timing.

The energization time counting unit may be replaced with a lightquantity measuring unit that measures the light quantity of at leastpart of light from the light emitting unit, and may perform anotification when this light quantity is equal to or smaller than apredetermined replacement light quantity.

In response to the notification by the replacement the notifying unit,the operator or the serviceperson replaces the electro-optic conversionelement 921. A part to be replaced may be the entire composite cable 6including the electro-optic conversion element 921, only theelectro-optic conversion element 921, or the entire electro-opticcombined modules 9 and 9A. When the electro-optic conversion element 921is provided to the camera head 5, the camera head 5 may be replaced.This enables optical transmission constantly without performancedegradation.

In an endoscope image-capturing device according to the presentdisclosure, an image sensor is arranged in a first case the inside ofwhich is sealed. An electro-optic conversion element is arranged outsidethe first case, receives an image signal from the image sensor arrangedinside the first case through wireless communication or through asealing connector such as a hermetic connector attached to the firstcase, and converts this image signal into an optical signal. Theelectro-optic conversion element is sealed by a sealing member.

Thus, the endoscope image-capturing device according to the presentdisclosure may achieve a small configuration that optically transmits animage signal at low cost and may protect, with the sealing member, theelectro-optic conversion element against a medicinal solution used insterilization involving wiping and liquid immersion and high-temperatureand high-pressure vapor in autoclave processing.

An endoscope device according to the present disclosure includes theendoscope image-capturing device described above and thus provides thesame advantageous effect as the above-described advantageous effect ofthe endoscope image-capturing device.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An endoscope image-capturing device comprising: afirst case having an outer surface to be held by a user when the useroperates the endoscope image-capturing device, an inside of the firstcase being sealed; an image sensor arranged inside the first case; asecond case that partially overlaps with the first case; anelectro-optic conversion element arranged inside the second case andconfigured to convert an electric image signal output from the imagesensor into an optical signal, the image sensor inside the first caseand the electro-optic conversion element inside the second case beingelectrically connected with each other when in operation; and a sealingmember sealing the electro-optic conversion element arranged inside thesecond case, wherein the image sensor is not arranged inside the secondcase, and the second case is not arranged entirely inside the firstcase.
 2. The endoscope image-capturing device according to claim 1,wherein the sealing member includes resin that covers the electro-opticconversion element and seals the electro-optic conversion element. 3.The endoscope image-capturing device according to claim 2, wherein theresin fills at least an opening of the second case.
 4. The endoscopeimage-capturing device according to claim 1, further comprising: ablocking part blocking an opening of the first case to seal the insideof the first case; and a printed-circuit board that is arranged outsidethe first case and on which the electro-optic conversion element ismounted, wherein the blocking part is provided with a terminalconfigured to electrically couple the image sensor arranged inside thefirst case and the printed-circuit board arranged outside the firstcase.
 5. The endoscope image-capturing device according to claim 4,wherein the blocking part is a sealing connector.
 6. The endoscopeimage-capturing device according to claim 1, wherein the inside of thefirst case is held airtightly.
 7. An endoscope device comprising theendoscope image-capturing device according to claim
 1. 8. The endoscopedevice according to claim 7, wherein the image sensor has number ofeffective pixels of eight megapixels or larger.
 9. The endoscope deviceaccording to claim 8, further comprising a display configured to displayan image captured by the endoscope image-capturing device, wherein thedisplay has a monitor size of 55 inches or larger.
 10. The endoscopeimage-capturing device according to claim 1, wherein the sealing memberentirely seals the electro-optic conversion element.
 11. The endoscopeimage-capturing device according to claim 1, wherein the sealing memberseals the electro-optic conversion element to enable autoclaveprocessing.
 12. The endoscope image-capturing device according to claim1, wherein the sealing member fills a space inside the second case. 13.The endoscope image-capturing device according to claim 1, wherein thefirst case and the second case are connected via a connector.
 14. Theendoscope image-capturing device according to claim 1, furthercomprising a switch exposed on the outer surface of the first case, theswitch being to be operated by the user.
 15. The endoscopeimage-capturing device according to claim 1, wherein the second case isdetachable from the first case.